IPC-A-610DC-Telecom Addendum

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

J-STD-004B-CN: 修订本 1 助焊剂要求

J-STD-003C-CN-WAM1: 印制板可焊性测试

IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

T-50H-CN: 电子电路互连与封装术语及定义

IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards

IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

IPC-1753: Laboratory Report Standard

9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

J-STD-030A: Selection and Application of Board Level Underfill Materials

1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document