75 Products

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirement

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IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirements

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IPC/JEDEC-9707-AM1: Spherical Bend Test Method for Characterization of Board Level Interconnects

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620

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IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620

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IPC-1753-WAM1: Laboratory Report Standard

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IPC-1753-WAM 1: Laboratory Report Standard - English

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical...

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C

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IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C

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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

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J-STD-003C-CN-WAM1: 印制板可焊性测试

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

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D-859: Design Standard for Thick Film Multilayer Hybrid Circuits