IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...
IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors
IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films
IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives
J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes
7095B(D)1: Design and Assembly Process Implementation for BGAs
REACHGUIDE08: REACH & The Electronics Industry Supply Chain: The Basics, the Impact and How to...