24 Products

Member: $62.00

Nonmember: $124.00

IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

Member: $123.00

Nonmember: $246.00

IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項

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Nonmember: $0.00

IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC-A-610DC-Telecom Addendum

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

Member: $123.00

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A-610DJP(D)1: Acceptability of Electronic Assemblies

Member: $67.00

Nonmember: $135.00

J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

Member: $95.00

Nonmember: $191.00

J-STD-004A-JP: Requirements for Soldering Fluxes

Member: $84.00

Nonmember: $168.00

J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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Nonmember: $135.00

IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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Nonmember: $116.00

IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

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Nonmember: $135.00

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

Member: $65.00

Nonmember: $131.00

D-356B: Bare Substrate Electrical Test Data Format

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IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

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Nonmember: $93.00

IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

Member: $65.00

Nonmember: $131.00

IPC-9199: Statistical Process Control (SPC) Quality Rating

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Nonmember: $93.00

IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

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IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

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Nonmember: $119.00

7095B(D)1: Design and Assembly Process Implementation for BGAs

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Nonmember: $53.00

REACHGUIDE08: REACH & The Electronics Industry Supply Chain: The Basics, the Impact and How to...