IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項

IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

A-610DJP(D)1: Acceptability of Electronic Assemblies

J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

J-STD-004A-JP: Requirements for Soldering Fluxes

J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

D-356B: Bare Substrate Electrical Test Data Format

IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

IPC-9199: Statistical Process Control (SPC) Quality Rating

IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives

IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

IPC-9641: High Temperature Printed Board Flatness Guideline

J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

IPC-2291: Design Guideline for Printed Electronics

IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits