IPC-4556-AM1: is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendment...
IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B
IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies
J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies
IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
IPC/WHMA-A-620A-DE: Rev A superseded by Rev B
IPC-6012DA-DE: Ergänzung für Anwendungen der Automobilbranche zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten
D-356B: Bare Substrate Electrical Test Data Format
IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...
IPC-9199: Statistical Process Control (SPC) Quality Rating
IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings
IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-9641: High Temperature Printed Board Flatness Guideline
J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC-2291: Design Guideline for Printed Electronics
IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC-7095C: Design and Assembly Process Implementation for BGAs
IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry
IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-9241: Guidelines for Microsection Preparation