35 Products

Member: $68.00

Nonmember: $137.00

EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

Member: $131.00

Nonmember: $263.00

IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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Nonmember: $315.00

IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

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Nonmember: $95.00

IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility

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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

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IPC-J-STD-003C-WAM1: Solderability Tests for Printed Boards

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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Nonmember: $441.00

IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

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IPC-1072AM1: Intellectual Property Protection in Electronic Assembly Manufacturing

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IPC-4550-FAM: Plating Specifications

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7090-FAM: Packages for PCBs and Assemblies

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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies

Member: $267.00

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PtdEleFAM: Printed Electronics Family

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SolMatFAM: Solder Materials Family

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D-356B: Bare Substrate Electrical Test Data Format

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IPC-9199: Statistical Process Control (SPC) Quality Rating

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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC/WHMA-A-620C REDLINE: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards