27 Products

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-A-610E-EE: Elektroonikakoostude vastavusnõuded

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IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten

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IPC-A-610F-SE: Acceptanskrav för kretskort

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J-STD-001E-SE: Krav för lödda elektriska och elektroniska kretskort

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IPC-A-610E-SE: Acceptanskrav för kretskort

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IPC-A-610E-HU: Elektronikai szerelvények elfogadhatósága

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IPC-A-610F-HU: Elektronikai szerelvények elfogadhatósága

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J-STD-001E-HU: Villamos és elektronikai szerelvények forrasztási követelményei

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IPC-D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies

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IPC-CM-770E: Component Mounting Guidelines for Printed Boards

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

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IPC-7912A: End-Item DPMO for Printed Circuit Board Assemblies

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IPC-1720A: Assembly Qualification Profile

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IPC-1710A: OEM Standard for Printed Board Manufacturer's Qualification Profile (MQP)

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1756: Manufacturing Process Data Management

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IPC-A-610E: Acceptability of Electronic Assemblies

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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation