69 Products

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-7801: 再流焊炉工艺控制标准 - Chinese

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IPC-7801: 再流焊炉工艺控制标准 - Chinese

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9702-CN: 板极互连的单向弯曲特性描述

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J-STD-003C-CN-WAM1: 印制板可焊性测试

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

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IPC-A-610F AM1-CN: 电子组件的可接受性 修订本1

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IPC-6012D-CN: 刚性印制板的鉴定及性能规范

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IPC-1720A-CN: 组装资格认证纲要

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IPC-D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies

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IPC-CM-770E: Component Mounting Guidelines for Printed Boards

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IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

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IPC-7912A: End-Item DPMO for Printed Circuit Board Assemblies

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IPC-1720A: Assembly Qualification Profile

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IPC-1710A: OEM Standard for Printed Board Manufacturer's Qualification Profile (MQP)

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-1753: Laboratory Report Standard

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives