14 Products

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Nonmember: $246.00

IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項

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IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項

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A-610DJP(D)1: Acceptability of Electronic Assemblies

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J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

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J-STD-004A-JP: Requirements for Soldering Fluxes

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IPC-2221B-FR: Norme Générique de Conception du Circuit imprimé

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IPC-A-610DFR: Acceptability of Electronic Assemblies

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IPC/WHMA-A-620B-FR: Exigences et critères d'acceptabilité pour l'interconnexion des faisceaux de fils et de câbles

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

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IPC/WHMA-A-620B-DE: Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile

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IPC/WHMA-A-620B-DE: Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen