17 Products

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

Member: $47.00

Nonmember: $93.00

J-STD-075-CN: 组装工艺中非IC电子元器件的分级

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4562A-CN: 印制板用金属箔

Member: $168.00

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IPC-7711/21B-CN: 电子组件的返工、修改和维修

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1

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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

Member: $84.00

Nonmember: $168.00

J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

Member: $67.00

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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IPC-HDBK-005: Guide to Solder Paste Assessment

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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

Member: $47.00

Nonmember: $93.00

IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

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Nonmember: $93.00

J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

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7095B(D)1: Design and Assembly Process Implementation for BGAs

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REACHGUIDE08: REACH & The Electronics Industry Supply Chain: The Basics, the Impact and How to...