17 Products

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J-STD-075-CN: 组装工艺中非IC电子元器件的分级

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4562A-CN: 印制板用金属箔

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IPC-CH-65B-CN: 印制板及组件清洗指南

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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

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IPC-7525B-CN: 模板设计指导

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J-STD-004B-CN: 修订本 1 助焊剂要求

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IPC-7711/21B-CN: 电子组件的返工、修改和维修

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IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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T-50H-CN: 电子电路互连与封装术语及定义

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1

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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes