19 Products

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC-A-610DC-Telecom Addendum

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-075-CN: 组装工艺中非IC电子元器件的分级

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4562A-CN: 印制板用金属箔

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J-STD-004B-CN: 修订本 1 助焊剂要求

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IPC-7711/21B-CN: 电子组件的返工、修改和维修

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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T-50H-CN: 电子电路互连与封装术语及定义

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1

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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

Member: $47.00

Nonmember: $93.00

IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

Member: $84.00

Nonmember: $168.00

IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

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7095B(D)1: Design and Assembly Process Implementation for BGAs

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REACHGUIDE08: REACH & The Electronics Industry Supply Chain: The Basics, the Impact and How to...