51 Products

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1756: Manufacturing Process Data Management

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IPC-A-610E: Acceptability of Electronic Assemblies

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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001

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J-STD-005A: Requirements for Soldering Pastes

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IPC/WHMA-A-620B: Superseded by IPC/WHMA-A-620C: IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies

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J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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7095B(D)1: Design and Assembly Process Implementation for BGAs

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IPC/JEDEC-9704A: Printed Circuit Assembly Strain Gage Test Guideline

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IPC/JPCA-4921: Requirements for Printed Electronics Base Materials (Substrates)

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IPC/WHMA-A-620AS WAM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC-7527: Requirements for Solder Paste Printing

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IPC-9151D: Process Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database

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REACHGUIDE08: REACH & The Electronics Industry Supply Chain: The Basics, the Impact and How to...

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J-STD-005A: Requirements for Soldering Pastes

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IPC/WHMA-A-620B-DE: Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

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IPC-HDBK-850: Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for...

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IPC-AJ-820A: Assembly & Joining Handbook