37 Products

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten

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J-STD-075-CN: 组装工艺中非IC电子元器件的分级

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IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

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4562A-CN: 印制板用金属箔

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IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级

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IPC-7711/21B-CN: 电子组件的返工、修改和维修

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IPC-A-610E-CN: 电子组件的可接受性

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J-STD-001E-CN: Rev E superseded by Rev F

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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IPC-1601-CN: 印制板操作和贮存指南

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J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1

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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen

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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...