IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B
IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies
J-004A-CN: SUPERSEDED BY J-STD-004B-CN
J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1
IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...
J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies
IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
IPC/WHMA-A-620A-DE: Rev A superseded by Rev B
IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...
IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings
IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-9641: High Temperature Printed Board Flatness Guideline
J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC-2291: Design Guideline for Printed Electronics