IPC-A-610E-RL: Acceptability of Electronic Assemblies
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...
J-STD-004B-CN: 修订本 1 助焊剂要求
IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级
J-STD-001E-CN: Rev E superseded by Rev F
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards
1756: Manufacturing Process Data Management
IPC-A-610E: Acceptability of Electronic Assemblies
1751A: Generic Requirements for Declaration Process Management - includes Amendment 1
J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies
IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components