IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies
IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirement
IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC/JEDEC-9707-AM1: Spherical Bend Test Method for Characterization of Board Level Interconnects
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
IPC-1753-WAM1: Laboratory Report Standard
IPC-1753-WAM 1: Laboratory Report Standard - English
IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical...
IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
IPC/WHMA-A-620A-PL: Rev A superseded by Rev B
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability