IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
Electronics Assembly
6 Products
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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
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IPC-A-610DC-Telecom Addendum
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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes
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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components