49 Products

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

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IPC-CH-65B-CN: 印制板及组件清洗指南

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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

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IPC-7525B-CN: 模板设计指导

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J-STD-003C-CN-WAM1: 印制板可焊性测试

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范

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IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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IPC-1753: Laboratory Report Standard

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

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J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

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IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-A-610F: Acceptability of Electronic Assemblies