40 Products

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IPC/WHMA-A-620 Test Data Tables

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IPC/WHMA-A-620B-Redline

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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC/JEDEC J-STD-609A Errata Information

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IPC-2220-FAM: Design Standards for Printed Boards

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A-620B-PL: Wymagania i akceptacje dla montażu kabli i wiązek przewodów

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IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing

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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

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J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1

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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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J-STD-048: Notification Standard for Product Discontinuance

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-1755 Amendment 1: Conflict Minerals Data Exchange Standard Amendment 1

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IPC-7801: Reflow Oven Process Control Standard

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001

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J-STD-005A: Requirements for Soldering Pastes

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IPC/WHMA-A-620B: Superseded by IPC/WHMA-A-620C: IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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IPC/JEDEC-9704A: Printed Circuit Assembly Strain Gage Test Guideline

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IPC/JPCA-4921: Requirements for Printed Electronics Base Materials (Substrates)