J-STD-004B-CN: 修订本 1 助焊剂要求
Acceptance
9 Products
T-50H-CN: 电子电路互连与封装术语及定义
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610DC-Telecom Addendum
IPC/WHMA-A-620A-PL: Rev A superseded by Rev B
J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes
IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations