J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés
Acceptance
13 Products
IPC-A-610F-AM1-FR: Acceptabilité des Assemblages Électroniques
J-STD-001F-AM1-RO: Cerințe pentru Ansamblurile Electrice și Electronice Lipite
IPC-A-610F AM1-CN: 电子组件的可接受性 修订本1
J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1
IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试
IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级
IPC-7092: Design and Assembly Process Implementation for Embedded Components
IPC-7092: Design and Assembly Process Implementation for Embedded Components
IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
IPC-J-STD-020E: Clasificación de la sensibilidad a la humedad / reflujo de dispositivos de montaje superficial...
J-STD-001FS-SP: Adición de dispositivos electrónicos para aplicaciones espaciales del IPC J-STD-001F Requisitos Para Uniones Eléctricas...
IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations