IPC-9850A: Surface Mount Placement Equipment Characterization

IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components