Acceptance

24 Products

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J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés

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IPC-A-610F-AM1-FR: Acceptabilité des Assemblages Électroniques

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J-STD-001F-AM1-RO: Cerințe pentru Ansamblurile Electrice și Electronice Lipite

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IPC-A-610F AM1-CN: 电子组件的可接受性 修订本1

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IPC-A-610F-SE: Acceptanskrav för kretskort

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J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

Member: $84.00

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-J-STD-020E: Clasificación de la sensibilidad a la humedad / reflujo de dispositivos de montaje superficial...

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J-STD-001FS-SP: Adición de dispositivos electrónicos para aplicaciones espaciales del IPC J-STD-001F Requisitos Para Uniones Eléctricas...

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J-STD-001FS-SP: Adición de dispositivos electrónicos para aplicaciones espaciales del IPC J-STD-001F Requisitos Para Uniones Eléctricas...

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IPC-9850A: Surface Mount Placement Equipment Characterization

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IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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EMSMTG-PRINTELEC4-11: The Impact of Printed Electronics on the EMS Industry

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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

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IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components