IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項
Electronics Assembly
334 Products
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IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項
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IPC-J-STD-001G-AM1: はんだ付される電気及び電子組立品に関する要件事項 改訂1
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IPC-4556-AM1: is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendment...
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IPC-1791-AM1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1
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IPC-J-STD-001G-AM1: J-STD-001G-AM1-SP / Provee requisitos para materiales de soldadura y procesos para ensambles
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J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
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IPC-2591: Connected Factory Exchange (CFX)-JP
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IPC-2591: Intercambio en fábricas conectadas (CFX)
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IPC-2591: Intercambio en fábricas conectadas (CFX)
Member: $53.00 Nonmember: $80.00
IPC-J-STD-001G-AM1: はんだ付される電気及び電子組立品に関する要件事項 改訂1
Member: $84.00 Nonmember: $168.00
IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1
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IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1
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IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly
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IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly
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IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1
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IPC-2591: Connected Factory Exchange (CFX)
Member: $84.00 Nonmember: $168.00
IPC-2591: Connected Factory Exchange (CFX)
Member: $53.00 Nonmember: $80.00
IPC-J-STD-001G-AM1: Provee requisitos para materiales de soldadura y procesos para ensambles
Member: $47.00 Nonmember: $93.00
IPC/JEDEC-J-STD-003D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso
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IPC/JEDEC-J-STD-033D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso
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IPC-9111: Troubleshooting for Printed Board Assembly Processes
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IPC-A-610G: Kritéria přijatelnosti elektronických sestav
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IPC-A-610G: Kritéria přijatelnosti elektronických sestav