347 Products

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IPC-4556-AM1: is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendment...

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IPC-1791-AM1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

Member: $45.00

Nonmember: $88.00

IPC-J-STD-001G-AM1: J-STD-001G-AM1-SP / Provee requisitos para materiales de soldadura y procesos para ensambles

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J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-2591: Intercambio en fábricas conectadas (CFX)

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IPC-2591: Intercambio en fábricas conectadas (CFX)

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IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

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IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

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IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

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IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

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IPC-7711/21C: Rework, modificatie en repair van elektronische assemblages - Chapter 1

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IPC-7711/21C: Rework, modificatie en repair van elektronische assemblages - Chapter 1

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IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

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IPC-2591: Connected Factory Exchange (CFX)

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IPC-2591: Connected Factory Exchange (CFX)

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IPC-J-STD-001G-AM1: Provee requisitos para materiales de soldadura y procesos para ensambles

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IPC/WHMA-A-620C: 케이블 및 와이어 하네스 어셈블리들에 대한 요건들 및 수용

Member: $152.00

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IPC/WHMA-A-620C: 케이블 및 와이어 하네스 어셈블리들에 대한 요건들 및 수용

Member: $123.00

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IPC-J-STD-001G: ข้อกำหนดสำหรับการบัดกรีอิเล็กทรอนิกส์และงานประกอบอิเล็กทรอนิกส์

Member: $123.00

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IPC-J-STD-001G: ข้อกำหนดสำหรับการบัดกรีอิเล็กทรอนิกส์และงานประกอบอิเล็กทรอนิกส์

Member: $47.00

Nonmember: $93.00

IPC/JEDEC-J-STD-003D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso

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IPC/JEDEC-J-STD-033D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso

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IPC-9111: Troubleshooting for Printed Board Assembly Processes

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IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies