289 Products

Member: $131.00

Nonmember: $263.00

IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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Nonmember: $315.00

IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility

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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

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IPC-J-STD-003C-WAM1: Solderability Tests for Printed Boards

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC/WHMA-A-620C-DE: Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

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IPC-1072AM1: Intellectual Property Protection in Electronic Assembly Manufacturing

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IPC-4550-FAM: Plating Specifications

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7090-FAM: Packages for PCBs and Assemblies

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BdMatFAM: Base Material Specifications for Printed Boards

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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies

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PtdEleFAM: Printed Electronics Family

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SolMatFAM: Solder Materials Family

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IPC-2220-FAM: Design Standards for Printed Boards

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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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IPC-7711/21B-DE: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices