274 Products

Member: $49.00

Nonmember: $93.00

J-STD-001D: Rev D superseded by Rev E

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Nonmember: $61.00

J-006A: SUPERSEDED BY J-STD-006B

Member: $65.00

Nonmember: $131.00

D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

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D-322: Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes

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IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards

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SMEMA 7: SMEMA7 - Fluid Dispensing Terms and Definitions

Member: $84.00

Nonmember: $168.00

IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

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SMEMA 5: SMEMA5 - Screen Printing Terms and Definitions

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Nonmember: $0.00

SMEMA 4: SMEMA4 - Reflow Terms and Definitions

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Nonmember: $131.00

IPC-S-816: SMT Process Guideline Checklist

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IPC-OI-645: Standard for Visual Optical Inspection Aids

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

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IPC-HM-860: Specification for Multilayer Hybrid Circuits

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IPC-HDBK-005: Guide to Solder Paste Assessment

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Nonmember: $63.00

J-004A: SUPERSEDED BY J-STD-004B

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Nonmember: $61.00

J-004: SUPERSEDED BY J-STD-004A

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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

Member: $0.00

Nonmember: $0.00

SMEMA 6: SMEMA6 - Electronics Cleaning Terms and Definitions

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SMEMA 3.1: SMEMA3.1 - Fiducial Mark Standard

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Nonmember: $131.00

D-356B: Bare Substrate Electrical Test Data Format

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IPC-D-325A: Documentation Requirements for Printed Boards

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IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

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IPC-CM-770E: Component Mounting Guidelines for Printed Boards