Standards: Electronics Assembly: Components

58 Products

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IPC/JEDEC-J-STD-033D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-7711/21C: 전자 어셈블리들의 리웤, 변경 및 수리

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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies

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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...

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IPC-7711/21C: Wprowadzanie Poprawek, Modyfikacja i Naprawa Zespołów Elektronicznych

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IPC-7711/21C: Rework, modificatie en repair van elektronische assemblages - Chapter 1

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IPC-7711/21C: Az elektronikai szerelvények újramunkálása, módosítása és javítása

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IPC-7711/21C-French: Reprise, Modification et Réparation des Assemblages Électroniques

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IPC-7711/21C: 電子組立品のリワーク、改造およびリペア

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IPC-7711/21C:Reparación, Modificación y Reparación de Ensambles Electrónicos - Spanish

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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German

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IPC-1782: 电子产品的制造和供应链可追溯性标准

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IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products

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IPC-A-610F-TR: Ek1'i içerir

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

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IPC-7092: Design and Assembly Process Implementation for Embedded Components