Standards: Electronics Assembly: Components

6 Products

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9702-CN: 板极互连的单向弯曲特性描述

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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

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IPC-CM-770E: Component Mounting Guidelines for Printed Boards

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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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IPC-9850A: Surface Mount Placement Equipment Characterization

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IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components