Standards: Electronics Assembly: Components

98 Products

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC-9850A: Surface Mount Placement Equipment Characterization

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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

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IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components

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1756: Manufacturing Process Data Management

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IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级

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J-STD-004B-CN: 修订本 1 助焊剂要求

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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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J-STD-075-CN: 组装工艺中非IC电子元器件的分级

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J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

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IPC-J-STD-075-Spanish: Clasificación de componentes electrónicos no-IC para procesos de ensamble

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7095B(D)1: Design and Assembly Process Implementation for BGAs

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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9702-CN: 板极互连的单向弯曲特性描述

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IPC-CM-770E: Component Mounting Guidelines for Printed Boards

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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components