Standards: Electronics Assembly: Material

111 Products

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IPC-CC-830C: 印制线路组件用电气绝缘化合物的鉴定及性能

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IPC-1782: 电子产品的制造和供应链可追溯性标准

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IPC-1782: 电子产品的制造和供应链可追溯性标准

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IPC-HDBK-005: 焊膏评估指南

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IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC/JEDEC J-STD-609A Errata Information

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-1753-WAM1: Laboratory Report Standard

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IPC-1753-WAM 1: Laboratory Report Standard - English

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC-7527: 焊膏印刷要求 - Chinese

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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7090-FAM: Packages for PCBs and Assemblies

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BdMatFAM: Base Material Specifications for Printed Boards

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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies