IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
Main Category
106 Products
Standards: Electronics Assembly: Material
106 Products
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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试
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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试
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IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范
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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
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IPC/JEDEC J-STD-609A Errata Information
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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes
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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014
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IPC-1753-WAM1: Laboratory Report Standard
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IPC-1753-WAM 1: Laboratory Report Standard - English
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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard
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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard
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IPC-7527: 焊膏印刷要求 - Chinese
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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications
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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English
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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...
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7090-FAM: Packages for PCBs and Assemblies
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BdMatFAM: Base Material Specifications for Printed Boards
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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies
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SolMatFAM: Solder Materials Family
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J-STD-001E-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri
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J-STD-001E-SE: Krav för lödda elektriska och elektroniska kretskort
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J-STD-001D-SW: Requirements for Soldered Electrical and Electronic Assemblies