Standards: Electronics Assembly: Material

85 Products

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IPC-1755A: Responsible Sourcing of Minerals Data Exchange Standard

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IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC-HDBK-005: 焊膏评估指南

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IPC-1753-WAM 1: Laboratory Report Standard - English

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC-CC-830C: 印制线路组件用电气绝缘化合物的鉴定及性能

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求

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IPC-1782: 电子产品的制造和供应链可追溯性标准

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IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1

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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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J-STD-048: Notification Standard for Product Discontinuance

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IPC-1755 Amendment 1: Conflict Minerals Data Exchange Standard Amendment 1

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies