Standards: Electronics Assembly: Material

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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IPC-HDBK-005: Guide to Solder Paste Assessment

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IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

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IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives

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IPC-CA-821: General Requirements for Thermally Conductive Adhesives - Single User Download