Standards: Electronics Assembly: Material

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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1756: Manufacturing Process Data Management

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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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IPC-HDBK-005: Guide to Solder Paste Assessment

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IPC-CA-821: General Requirements for Thermally Conductive Adhesives - Single User Download