J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
Standards: Electronics Assembly: Material
IPC-7095C: Design and Assembly Process Implementation for BGAs
IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
IPC-HDBK-005: Guide to Solder Paste Assessment
IPC-CA-821: General Requirements for Thermally Conductive Adhesives - Single User Download