Standards: Electronics Assembly: Material

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

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J-STD-004A-JP: Requirements for Soldering Fluxes

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J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

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4562A-CN: 印制板用金属箔

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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1

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Nonmember: $93.00

IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

Member: $84.00

Nonmember: $168.00

J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

Member: $47.00

Nonmember: $93.00

IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

Member: $47.00

Nonmember: $93.00

J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries