Standards: Electronics Assembly: Material

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards

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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1

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4562A-CN: 印制板用金属箔

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

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J-STD-004A-JP: Requirements for Soldering Fluxes

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J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies