Standards: Electronics Assembly: Material

22 Products

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IPC-1752B: Materials Declaration Management Standard

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IPC-1755A: Responsible Sourcing of Minerals Data Exchange Standard

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求

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IPC-1782: 电子产品的制造和供应链可追溯性标准

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IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products

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IPC-4556-AM1: is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendment...

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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-J-STD-006C: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項

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IPC-AJ-820A: Assembly & Joining Handbook

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J-STD-005A-JP: ソルダペーストに関する要求事項

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J-STD-005A: Requirements for Soldering Pastes