Standards: Electronics Assembly: Material

24 Products

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-1752A WAM1&2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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J-STD-005A: Requirements for Soldering Pastes

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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

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IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-4202B: Flexible Base Dielectrics for Use in Flexible Printed Boards

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

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J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-1753: Laboratory Report Standard