Standards: Electronics Assembly: Material

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-1752A WAM1&2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-1753: Laboratory Report Standard