Standards: Electronics Assembly: Material

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

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IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

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IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives

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IPC-CA-821: General Requirements for Thermally Conductive Adhesives - Single User Download