Standards: Electronics Assembly: Material

39 Products

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IPC-HDBK-005: 焊膏评估指南

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IPC-1753-WAM1: Laboratory Report Standard

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IPC-1753-WAM 1: Laboratory Report Standard - English

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC-CC-830C: 印制线路组件用电气绝缘化合物的鉴定及性能

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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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J-STD-048: Notification Standard for Product Discontinuance

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IPC-1755 Amendment 1: Conflict Minerals Data Exchange Standard Amendment 1

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014