Standards: Electronics Assembly: Material

25 Products

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IPC-HDBK-005: 焊膏评估指南

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IPC-1753-WAM1: Laboratory Report Standard

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IPC-1753-WAM 1: Laboratory Report Standard - English

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC-CC-830C: 印制线路组件用电气绝缘化合物的鉴定及性能

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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-J-STD-006C: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1

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4562A-CN: 印制板用金属箔

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

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J-STD-004A-JP: Requirements for Soldering Fluxes