Standards: Electronics Assembly: Material

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J-STD-001E-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

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J-STD-001E-SE: Krav för lödda elektriska och elektroniska kretskort

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J-STD-001E-RO: Cerinţe pentru Ansamblurile Electrice şi Electronice Lipite

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J-STD-001E-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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J-STD-001E-HU: Villamos és elektronikai szerelvények forrasztási követelményei

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J-STD-001E-CN: Rev E superseded by Rev F

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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J-STD-001E-SP: Requisitos de Ensambles Eléctricos y Electrónicos Soldados

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J-STD-001E-FR: Exigences des Assemblages Electriques et Electroniques Brasés

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1756: Manufacturing Process Data Management

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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

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J-STD-048: Notification Standard for Product Discontinuance

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IPC-1755 Amendment 1: Conflict Minerals Data Exchange Standard Amendment 1

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations

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J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F

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IPC-7092: Design and Assembly Process Implementation for Embedded Components