Standards: Electronics Assembly: Material

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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7090-FAM: Packages for PCBs and Assemblies

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BdMatFAM: Base Material Specifications for Printed Boards

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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies

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SolMatFAM: Solder Materials Family

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J-STD-001E-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

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J-STD-001E-SE: Krav för lödda elektriska och elektroniska kretskort

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J-STD-001E-RO: Cerinţe pentru Ansamblurile Electrice şi Electronice Lipite

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J-STD-001E-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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J-STD-001E-HU: Villamos és elektronikai szerelvények forrasztási követelményei

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J-STD-001E-CN: Rev E superseded by Rev F

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J-STD-001E-SP: Requisitos de Ensambles Eléctricos y Electrónicos Soldados

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J-STD-001E-FR: Exigences des Assemblages Electriques et Electroniques Brasés

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1756: Manufacturing Process Data Management

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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

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Nonmember: $166.00

IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards