Standards: Electronics Assembly: Material

23 Products

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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IPC-1753: Laboratory Report Standard

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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Nonmember: $168.00

IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

Member: $55.00

Nonmember: $109.00

IPC-1752A WAM1&2: Materials Declaration Management with Amendments 1 & 2

Member: $41.00

Nonmember: $83.00

IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

Member: $79.00

Nonmember: $155.00

IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

Member: $41.00

Nonmember: $83.00

IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

Member: $79.00

Nonmember: $155.00

J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

Member: $79.00

Nonmember: $155.00

IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

Member: $79.00

Nonmember: $155.00

IPC-7095C: Design and Assembly Process Implementation for BGAs

Member: $60.00

Nonmember: $119.00

IPC-1753: Laboratory Report Standard