IPC-HDBK-005: 焊膏评估指南
Standards: Electronics Assembly: Material
24 Products
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IPC-CC-830C: 印制线路组件用电气绝缘化合物的鉴定及性能
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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试
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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试
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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求
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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求
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IPC-1782: 电子产品的制造和供应链可追溯性标准
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IPC-1782: 电子产品的制造和供应链可追溯性标准
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IPC-HDBK-4691: 电子组件操作用粘合剂粘接手册
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IPC-HDBK-4691: 电子组件操作用粘合剂粘接手册
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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试
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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范
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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求
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IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范
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IPC-7527: 焊膏印刷要求 - Chinese
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J-STD-005A-CN: 焊膏要求
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J-STD-001E-CN: Rev E superseded by Rev F
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J-STD-004B-CN: 修订本 1 助焊剂要求
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T-50H-CN: 电子电路互连与封装术语及定义
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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...
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J-004A-CN: SUPERSEDED BY J-STD-004B-CN
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J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1
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4562A-CN: 印制板用金属箔