Standards: Electronics Assembly: Material

109 Products

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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7090-FAM: Packages for PCBs and Assemblies

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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies

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SolMatFAM: Solder Materials Family

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J-STD-001E-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

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J-STD-001E-SE: Krav för lödda elektriska och elektroniska kretskort

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J-STD-001D-SW: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-001E-RO: Cerinţe pentru Ansamblurile Electrice şi Electronice Lipite

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J-STD-001D-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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J-STD-001E-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

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J-STD-004A-JP: Requirements for Soldering Fluxes

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J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-001E-HU: Villamos és elektronikai szerelvények forrasztási követelményei

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4562A-CN: 印制板用金属箔

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J-STD-005A-CN: 焊膏要求

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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

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J-STD-004B-CN: 修订本 1 助焊剂要求

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J-STD-001E-CN: Rev E superseded by Rev F

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求