Standards: Electronics Assembly: Process Support

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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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IPC-J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-J-STD-001G: Provee requisitos para materiales de soldadura y procesos para ensambles

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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies

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IPC-7711/21C:Reparación, Modificación y Reparación de Ensambles Electrónicos